The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 22, 2026

Filed:

Aug. 10, 2022
Applicant:

Stmicroelectronics (Grenoble 2) Sas, Grenoble, FR;

Inventors:

Younes Boutaleb, Grenoble, FR;

Julien Cuzzocrea, Montbonnot Saint Martin, FR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 40/22 (2026.01); H10W 74/10 (2026.01);
U.S. Cl.
CPC ...
H10W 40/226 (2026.01); H10W 74/117 (2026.01);
Abstract

An integrated circuit package includes a base substrate with at least one electronic chip mounted on a face of the base substrate. The electronic chip is configured to have hot spots in operation emitting heat in a heat volume space. A coating encapsulates the at least one electronic chip. The coating has a bottom face mounted on the face of the base substrate and a profiled top face. A portion of the profile top face is configured to locally reduce a volume of a region of the coating. The portion is located at least in part in the heat volume space. A heat sink is mounted on the profiled top face of the coating using a mounting layer.


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