Ingolstadt, Germany

Juergen Martin

This inventor holds 2 USPTO granted patents. Top assignee: Conti Temic Microelectronic Gmbh. Active years: 2011-2014.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Juergen Martin. Retrieved from https://idiyas.com/inventor/juergen-martin-5xu59drj

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 50.0

Average Co-Inventor Count = 3.0

ph-index = 2

Forward Citations = 43(Granted Patents)


Company Filing History:


Years Active: 2011-2014

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2 patents (USPTO):Explore Patents

Title: Juergen Martin: Innovator in Electronic Assembly Technology

Introduction

Juergen Martin is a notable inventor based in Ingolstadt, Germany. He has made significant contributions to the field of electronic assembly technology, holding a total of 2 patents. His innovative designs focus on enhancing circuit protection through advanced electronic components.

Latest Patents

Juergen Martin's latest patents include two groundbreaking inventions. The first patent, titled "Electronic assembly having stressable contact bridge with fuse function," describes an electronic circuit that features a conductor path on a circuit board. This assembly includes at least one SMD component, electronic component, or electromechanical component connected to the conductor path. The design incorporates a soldered joint and a spring-loaded contact bridge that provides fuse protection. In cases of excessive power dissipation or high temperature, the soldered joint melts or softens, causing the contact bridge to spring open and interrupt the circuit.

The second patent, "Electronic assembly having spring-loaded contact bridge with fuse function," also focuses on circuit protection. This electronic assembly includes a circuit on a circuit board with a conductor path and at least one SMD component, electronic component, or electromechanical component. A circuit connection is established via a soldered joint and a spring-loaded contact bridge. When excessive power dissipation occurs, the soldered joint melts or weakens, allowing the contact bridge to open due to the spring force.

Career Highlights

Juergen Martin is currently employed at Conti Temic Microelectronic GmbH, where he continues to innovate in the field of electronic assemblies. His work has significantly impacted the design and functionality of electronic circuits, making them safer and more reliable.

Collaborations

Throughout his career, Juergen has collaborated with talented professionals, including Roberto Schlenker and Michael Nagel. These collaborations have fostered a creative environment that encourages innovation and the development of cutting-edge technologies.

Conclusion

Juergen Martin's contributions to electronic assembly technology demonstrate his commitment to innovation and safety in electronic circuits. His patents reflect a deep understanding of the challenges in the field and provide effective solutions for modern electronic applications.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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