The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 04, 2011
Filed:
Mar. 28, 2006
Applicants:
Roberto Schlenker, Ingolstadt, DE;
Michael Nagel, Nuremberg, DE;
Juergen Martin, Ingolstadt, DE;
Inventors:
Assignee:
Conti Temic microelectronic GmbH, Nuremberg, DE;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01H 85/36 (2006.01); H01H 37/76 (2006.01);
U.S. Cl.
CPC ...
Abstract
An electronic assembly includes an electronic circuit on a circuit board. The circuit includes a conductor path on the circuit board, and at least one SMD component, electronic component and/or electromechanical component that is mounted on the circuit board and connected to the conductor path. A circuit connection between any two of the conductor paths and/or the components is established via a soldered joint and a spring-loaded contact bridge. In the event of excessive power dissipation, the soldered joint melts or weakens and the contact bridge opens due to the spring force.