Suwon, South Korea

Ju Yeol Baek

This inventor holds 1 USPTO granted patent. Top assignee: Samsung Corning Co., Ltd.. Active years: 2003.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ju Yeol Baek. Retrieved from https://idiyas.com/inventor/ju-yeol-baek-dxg4lcvf

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2003

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1 patent (USPTO):Explore Patents

Title: Ju Yeol Baek: Innovator in Substrate Measurement Technology

Introduction

Ju Yeol Baek is a notable inventor based in Suwon-si, South Korea. He has made significant contributions to the field of substrate measurement technology. His innovative approach has led to the development of a unique on-line measuring system that enhances the accuracy of substrate thickness measurement.

Latest Patents

Ju Yeol Baek holds 1 patent for his invention titled "On-line measuring system for measuring substrate thickness and the method thereof." This system includes a first image detector, a second image detector, an elevator, and a display device. The first image detector identifies vertical variations of the substrate's bottom surface, while the second image detector captures an image of that surface. The elevator adjusts the position of the second image detector to maintain a constant vertical distance from the substrate, allowing for precise thickness calculations.

Career Highlights

Ju Yeol Baek is currently employed at Samsung Corning Co., Ltd., where he continues to innovate in the field of measurement technology. His work has been instrumental in advancing the capabilities of on-line measurement systems.

Collaborations

Some of his notable coworkers include Jong Eun Ha and Taek Cheon Kim, who contribute to the collaborative environment at Samsung Corning Co., Ltd.

Conclusion

Ju Yeol Baek's contributions to substrate measurement technology exemplify the impact of innovation in the field. His patented system represents a significant advancement in ensuring accurate substrate thickness measurements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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