This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Ju Hyung Lee: Semiconductor Packaging Inventor
Introduction
Ju Hyung Lee is an inventor based in Siheung-si, South Korea, and is associated with Samsung Electronics Co., Ltd. His work includes a patented method for fabricating a semiconductor package that uses an interposer.
Latest Patents
Lee is credited with 1 patent: “Method of Fabricating a Semiconductor Package Including an Interposer.” The method involves placing a preliminary semiconductor package on a stage. The package includes a substrate with an attached pad part, an interposer on the substrate, and a semiconductor chip between the substrate and interposer. A bonding tool is positioned on the interposer, with its second region aligned with the pad part, and the interposer and substrate are bonded together.
Career Highlights
Lee’s listed patent concerns semiconductor packaging, particularly the bonding of an interposer and substrate within a package structure. He is associated with Samsung Electronics Co., Ltd.
Collaborations
Lee’s listed coworkers include Dong UK Kwon and Sun Chul Kim.
Conclusion
Ju Hyung Lee’s patent reflects work on semiconductor package fabrication and interposer bonding, connecting his inventive activity with Samsung Electronics Co., Ltd.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile