Jr-Lin Hsu

Title: Jr-Lin Hsu: Innovator in Semiconductor Packaging

Introduction

Jr-Lin Hsu is a prominent inventor based in Taichung, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of 3 patents. His innovative designs focus on enhancing the functionality and efficiency of semiconductor packages.

Latest Patents

One of Jr-Lin Hsu's latest patents is titled "Semiconductor package having varying conductive pad sizes." This invention includes a package component with a non-planar surface and a number of conductive features. The conductive features consist of a first and a second conductive feature, arranged at different positions on the non-planar surface. Notably, the height of the first position is less than that of the second position, and the size of the first conductive feature is smaller than that of the second conductive feature. Another patent under his name also focuses on a semiconductor package with varying conductive pad sizes, emphasizing the arrangement of conductive connectors on the conductive features of the package component.

Career Highlights

Jr-Lin Hsu is currently employed at Taiwan Semiconductor Manufacturing Company Limited, where he continues to innovate in semiconductor technology. His work has been instrumental in advancing the capabilities of semiconductor packages, making them more efficient and effective for various applications.

Collaborations

Throughout his career, Jr-Lin Hsu has collaborated with notable colleagues, including Chih-Hao Lin and Chien-Kuo Chang. These collaborations have fostered a creative environment that encourages innovation and the development of cutting-edge technologies.

Conclusion

Jr-Lin Hsu is a key figure in the semiconductor industry, with a focus on innovative packaging solutions. His contributions through patents and collaborations highlight his commitment to advancing technology in this critical field.