The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 30, 2020
Filed:
Jan. 28, 2019
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Chih-Hao Lin, Hsinchu, TW;
Chien-Kuo Chang, Zhubei, TW;
Tzu-Kai Lan, Yilan, TW;
Chung-Chih Chen, Hsinchu, TW;
Jr-Lin Hsu, Taichung, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu, TW;
Abstract
A semiconductor package is provided, including a package substrate, a package component, and a number of conductive connectors. The package component has a number of conductive features on a first surface of the package component facing the package substrate. The conductive connectors electrically connect the conductive features of the package component to the package substrate. The conductive features include a first conductive feature and a second conductive feature contacting a first conductive connector and a second conductive connector, respectively. The size of the first conductive feature is smaller than the size of the second conductive feature, and the height of the first conductive connector on the first conductive feature is greater than the height of the second conductive connector on the second conductive feature.