Company Filing History:
Years Active: 2010
Title: Joseph Villani: Innovator in Integrated Circuit Packaging
Introduction
Joseph Villani is a notable inventor based in Sugar Land, TX (US). He has made significant contributions to the field of integrated circuit packaging. His innovative approach has led to the development of a unique patent that enhances the efficiency and reliability of circuit modules.
Latest Patents
Joseph Villani holds a patent for "Stacked Module Systems." This invention focuses on stacking integrated circuit packages into circuit modules. In a preferred embodiment, solder paste and primary adhesive are applied to selected locations on the flex circuitry. Supplemental adhesive is also applied to additional locations on the flex circuitry, CSP, or other components. The flex circuitry and the CSP are brought into proximity with each other. During the solder reflow operation, a force is applied, causing the CSP to collapse toward the flex circuitry, displacing the primary adhesive and the supplemental adhesive. The supplemental adhesive establishes a bond that provides additional support to the flex circuitry. In another embodiment, CSPs or other integrated circuit packages are bonded to each other or to other components using a combination of adhesives. A rapid bond adhesive maintains alignment during assembly, while a structural bond adhesive provides additional strength and structural integrity to the bond. Joseph Villani has 1 patent to his name.
Career Highlights
Joseph Villani is associated with Entorian Technologies LP, where he has contributed to various projects and innovations. His work has been instrumental in advancing the technology related to integrated circuits and their applications.
Collaborations
Joseph has collaborated with notable colleagues such as Julian Partridge and James Douglas Wehrly, Jr. Their combined expertise has fostered an environment of innovation and creativity within their projects.
Conclusion
Joseph Villani is a distinguished inventor whose work in integrated circuit packaging has made a significant impact in the field. His patent for stacked module systems exemplifies his innovative spirit and dedication to advancing technology.
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