For the Inventor, By the Inventor

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Austin, TX, United States of America

Entorian Technologies LP

Calculating rank

USPTO Granted Patents = 48

% Expired Patents = 4.2

Forward Citations = 332

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26 inventors (with patents filed for the assignee):

James Douglas Wehrly, Jr (26 out of 48 patents)

Paul Goodwin (22 out of 25 patents)

James G Wilder (13 out of 30 patents)

4. Julian Partridge (13 out of 21 patents)

5. David Roper (12 out of 31 patents)

6. James W Cady (12 out of 39 patents)

7. Leland Szewerenko (8 out of 10 patents)

8. Mark Wolfe (7 out of 10 patents)

9. Russell Rapport (6 out of 14 patents)

10. Ron Orris (3 out of 4 patents)

11. Jeff Buchle (3 out of 13 patents)

12. Jeffrey Alan Buchle (2 out of 4 patents)

13. Douglas Wehrly (2 out of 2 patents)

14. Robert Washburn (2 out of 3 patents)

15. Thomas Branca (1 out of 1 patent)

Core Competencies:

Integrated Circuit

Stacking

Thermal Management

Flash Memory

High Density

Circuit Module

Memory Expansion

Low Profile

Stacked Modules

Flex Circuit

Carrier Structure

Die Module

48 patents: Sort by Forward Citations

1. 8341311 - System and method for reduced latency data transfers from flash memory to host by utilizing concurrent transfers into RAM buffer memory and FIFO host interface (2012-12-25),

2. 7804985 - Circuit module having force resistant construction (2010-09-28),

3. 7768796 - Die module system (2010-08-03),

4. 7760513 - Modified core for circuit module system and method (2010-07-20),

5. 7759791 - High density IC module (2010-07-20),

6. 7737549 - Circuit module with thermal casing systems (2010-06-15),

7. 7719098 - Stacked modules and method (2010-05-18),

8. 7675155 - Carrier structure stacking system and method (2010-03-09),

9. 7656678 - Stacked module systems (2010-02-02),

10. RE41039 - Stackable chip package with flex carrier (2009-12-14),

11. 7626273 - Low profile stacking system and method (2009-12-01),

12. 7626259 - Heat sink for a high capacity thin module system (2009-12-01),

13. 7616452 - Flex circuit constructions for high capacity circuit module systems and methods (2009-11-10),

14. 7608920 - Memory card and method for devising (2009-10-27),

15. 7606050 - Compact module system and method (2009-10-20),

Company Overview

Entorian Technologies LP, based in Austin, TX, specializes in advanced technologies related to data transfers and memory solutions. The company focuses on developing innovative products in flash memory, integrated circuit stacking, and high-density integrated circuits. Their expertise extends to thermal management and memory expansion, enabling efficient and scalable solutions for modern computing needs. Entorian's commitment to enhancing chip packaging and stackable designs positions them as a key player in the semiconductor industry.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 20 2026

48 Patents

#57 in Austin, TX

#391 in Texas

#7,288 in US

#14,561 in the World

Austin, TX, United States of America

Entorian Technologies LP

Forward Citations = 332

26 inventors:

James Douglas Wehrly, Jr (26 out of 48 patents)

Paul Goodwin (22 out of 25 patents)

James G Wilder (13 out of 30 patents)

4. Julian Partridge (13 out of 21 patents)

5. David Roper (12 out of 31 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Entorian Technologies LP. Retrieved from https://idiyas.com/company/entorian-technologies

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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