The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 20, 2010
Filed:
Apr. 20, 2007
Julian Partridge, Austin, TX (US);
Leland Szewerenko, Austin, TX (US);
James Douglas Wehrly, Jr., Austin, TX (US);
Julian Partridge, Austin, TX (US);
Leland Szewerenko, Austin, TX (US);
James Douglas Wehrly, Jr., Austin, TX (US);
Entorian Technologies LP, Austin, TX (US);
Abstract
A system and method for assembling dual-die integrated circuit packages using thermocompression bonding or thermosonic bonding to bond a second die to a substrate opposite a first die bonded to the substrate. The second die is bonded using heat conducted through the first die to the substrate, and optionally through an underfill material. The first and second die are connected such that bumps are connected to common bonding pads on the substrate. Bumps on one of the die extend through openings in the substrate to connect to the common bonding pads. The bonding pads are within the perimeter of the first die.