Company Filing History:
Years Active: 1992-1994
Title: Joseph M Zachman: Innovator in Through Hole Substrate Printing
Introduction
Joseph M Zachman is a notable inventor based in Greentown, Indiana, with a focus on advancements in substrate printing technology. He holds a total of 3 patents that contribute to the field of electronics manufacturing.
Latest Patents
Zachman's latest patents include a method and apparatus for through hole substrate printing. This innovative method enables automated printing of through holes that extend between the top and bottom surfaces of a ceramic substrate. The process involves placing the substrate on a support that maintains the bottom surface spaced from an interacting member. This member features holes that align with the substrate's through holes, allowing conductive material to be applied effectively. The vacuum mechanism used in this process ensures that the conductive material is pulled through the substrate's holes, enhancing the efficiency of the printing operation.
Another significant patent by Zachman describes an apparatus for through hole substrate printing that includes a nest plate with vacuum source holes larger than the substrate's through holes. This design incorporates removable pointed pins that support the substrate in a flat position during printing. This flexibility allows for the creation of various conductive patterns without risking damage to the substrate or smearing the conductive material.
Career Highlights
Zachman is associated with Delco Electronics Corporation, where he has made significant contributions to the field of electronics. His work has been instrumental in developing methods that improve the efficiency and reliability of substrate printing processes.
Collaborations
Throughout his career, Zachman has collaborated with notable colleagues, including Clyde E Ragan and Steven L Alexander. These collaborations have furthered advancements in the technologies related to substrate printing.
Conclusion
Joseph M Zachman is a distinguished inventor whose work in through hole substrate printing has made a significant impact on the electronics industry. His innovative methods and apparatuses continue to influence the field, showcasing his dedication to advancing technology.