Delco Electronics Corporation

Joseph M Zachman

Bruce Alan Myers

Charles T Eytcheson

Clyde E Ragan

Steven L Alexander

Michael G Coady

Jeffery P Somers

Donald E Eagle

Sherri L Bernhard

A method and apparatus are disclosed for enabling automated printing of through holes extending between top and bottom surfaces of a ceramic substrate or the like. The perimeter of the substrate is placed on a support that locates the bottom surface of the substrate spaced from a member that interacts with the interior portion of the substrate. The interacting member has holes that correspond to the through holes in the substrate, and it is moved generally perpendicular to the substrate to a position where it is in juxtaposition with the bottom surface of the substrate and its holes are in registration with the holes in the substrate. Conductive material is applied to the top surface of the substrate and a vacuum is applied to the holes in the interacting member to pull the conductive material through the through holes in the substrate. The vacuum is then discontinued and the interacting member is moved back to a position where it is spaced from the bottom surface of the substrate.

Method and apparatus for through hole substrate printing

Disclosed is an apparatus and method of through hole substrate printing wherein the apparatus includes a nest plate having a plurality of vacuum source holes formed therein of a size substantially greater than the through holes in the substrate, and a plurality of removable pointed pins supporting the substrate in a substantially flat and horizontal position during the printing operation. The removably pointed pins allow for the flexibility of printing a variety of conductive patterns for different substrates and without the risk of breaking the substrate or smearing the conductive pattern on the bottom surface of the substrate or the subsequent substrate to be printed.

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Greentown, IN, United States of America

Joseph M Zachman