New Hyde Park, NY, United States of America

Joseph M Daszkowski

This inventor holds 2 USPTO granted patents. Top assignee: Fairchild Weston Systems, Inc.. Active years: 1987.


% Patents Active = 100.0

Average Co-Inventor Count = 1.0

ph-index = 2

Forward Citations = 88(Granted Patents)


Company Filing History:


Years Active: 1987

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2 patents (USPTO):Explore Patents

Title: Joseph M. Daszkowski: Innovator in Thermal Management Solutions

Introduction

Joseph M. Daszkowski is a notable inventor based in New Hyde Park, NY (US). He has made significant contributions to the field of thermal management, holding two patents that showcase his innovative approach to solving complex engineering challenges.

Latest Patents

One of Joseph's latest patents is focused on a thermal link that provides a thermal path between a heat source and a heat sink. This invention compensates for irregularities on the surfaces of both the heat source and heat sink, as well as any nonuniformity in the spacing between them. One embodiment of this thermal link utilizes a spring metal device with a free arm, allowing the link to align itself under low pressure, ensuring intimate contact with both the heat source and heat sink. Another embodiment employs an elastomeric material filled with thermally conducting particles, forming a mat with raised sections and air spaces between them. These raised areas deform under low pressure, expanding laterally into the air spaces to conform to the space between the heat source and the heat sink.

Career Highlights

Joseph M. Daszkowski is currently associated with Fairchild Weston Systems, Inc., where he continues to develop innovative solutions in thermal management. His work has been instrumental in advancing technologies that require efficient heat dissipation.

Collaborations

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Conclusion

Joseph M. Daszkowski's contributions to thermal management through his innovative patents highlight his expertise and commitment to engineering excellence. His work continues to influence the industry and pave the way for future advancements in thermal solutions.

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