Endwell, NY, United States of America

Joseph J Sniezek

This inventor holds 4 USPTO granted patents. Top assignee: International Business Machines Corporation. Active years: 1990-2003.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Joseph J Sniezek. Retrieved from https://idiyas.com/inventor/joseph-j-sniezek

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 50.0

Average Co-Inventor Count = 5.0

ph-index = 4

Forward Citations = 87(Granted Patents)


Company Filing History:


Years Active: 1990-2003

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4 patents (USPTO):Explore Patents

Title: Joseph J Sniezek: Innovator in Printed Wiring Board Technology

Introduction

Joseph J Sniezek is a notable inventor based in Endwell, NY (US). He has made significant contributions to the field of printed wiring board technology, holding a total of 4 patents. His work focuses on enhancing the performance and functionality of electronic components through innovative designs.

Latest Patents

Sniezek's latest patents include a structure for high-speed printed wiring boards with multiple differential impedance-controlled layers. This invention outlines a method and arrangement for creating an impedance-controlled printed wiring board, particularly emphasizing the formation of structures that incorporate multiple differential impedance-controlled layers. Additionally, it provides vias of various types, such as through-holes, blind holes, and buried holes, filled with conductive paste material to establish electrical interconnections with the conductive layers of the printed wiring board.

Another significant patent is for a method of making a parallel capacitor laminate. This invention describes a parallel capacitor structure that can serve as an internal component of a larger circuit board, providing necessary capacitance. The capacitor can also function as an interconnector between different electronic components, such as chip carriers and circuit boards, while maintaining desired capacitance levels. The design includes at least one internal conductive layer, two additional conductor layers on opposite sides, and inorganic dielectric material, forming a parallel capacitor between the internal and added conductive layers and the outer conductors.

Career Highlights

Joseph J Sniezek is currently employed at International Business Machines Corporation (IBM), where he continues to innovate in the field of electronics. His work has been instrumental in advancing technologies that enhance the efficiency and effectiveness of electronic devices.

Collaborations

Throughout his career, Sniezek has collaborated with talented individuals such as Sylvia Adae-Amoakoh and John M Lauffer. These collaborations have contributed to the development of groundbreaking technologies in the electronics sector.

Conclusion

Joseph J Sniezek is a distinguished inventor whose work in printed wiring board technology has led to multiple patents and significant advancements in the field. His contributions continue to shape the future of electronic components and systems.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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