The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 27, 2003
Filed:
Jun. 11, 2001
Structure for high speed printed wiring boards with multiple differential impedance-controlled layer
Thomas Richard Miller, Endwell, NY (US);
Konstantinos I. Papathomas, Endicott, NY (US);
Brian Eugene Curcio, Binghamton, NY (US);
Joseph J. Sniezek, Endwell, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A method and arrangement for creating an impedance controlled printing wiring board, particularly the formation of a structure for high speed printed wiring boards incorporating multiple differential impedance controlled layers. Furthermore, there are provided vias of either through-holes, blind holes and buried holes filled with a conductive paste material to form electrical interconnections with conductive layers of the printed wiring board.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile