Company Filing History:
Years Active: 2004-2005
Title: Joseph J Dlugokecki: Innovator in Integrated Circuit Technology
Introduction
Joseph J Dlugokecki is a notable inventor based in Oceanside, CA (US). He has made significant contributions to the field of integrated circuit technology, holding 2 patents that showcase his innovative methods.
Latest Patents
Dlugokecki's latest patents include a "Method for reconstructing an integrated circuit package using lapping." This method involves attaching a die to exposed wire bond pads of a lead frame, encapsulating the die and wire bond pads, and reshaping the upper surface of the encapsulant through a lapping process. Another significant patent is the "Method for deconstructing an integrated circuit package using lapping." This method details the process of removing the encapsulant to expose the wire bond pads, with a portion of the encapsulant being removed by a lapping process.
Career Highlights
Throughout his career, Dlugokecki has worked with several companies, including Gel Pak LLC and Delphon Industries, LLC. His experience in these organizations has contributed to his expertise in integrated circuit packaging and deconstruction.
Collaborations
Dlugokecki has collaborated with professionals such as Gerardo Bagalawig Nazareno and Carmencita I Robbins, further enhancing his work in the field.
Conclusion
Joseph J Dlugokecki's innovative approaches to integrated circuit technology have led to valuable patents that advance the industry. His contributions reflect a commitment to improving electronic packaging methods.