The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 26, 2005
Filed:
Jan. 07, 2002
Joseph J. Dlugokecki, Oceanside, CA (US);
Gerardo Bagalawig Nazareno, San Diego, CA (US);
Carmencita I. Robbins, San Diego, CA (US);
Steven David Swendrowski, San Diego, CA (US);
Joseph J. Dlugokecki, Oceanside, CA (US);
Gerardo Bagalawig Nazareno, San Diego, CA (US);
Carmencita I. Robbins, San Diego, CA (US);
Steven David Swendrowski, San Diego, CA (US);
Delphon Industries, LLC, Hayward, CA (US);
Abstract
A method is provided for reconstructing an integrated circuit package comprising: attaching a die to exposed wire bond pads of a lead frame so that the die is electrically connected to the lead frame; and encapsulating the die and the wire bond pads in an encapsulant; and reshaping an upper surface of the encapsulant where at least a portion of the encapsulant reshaping is performed by a lapping process.