The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 09, 2004
Filed:
Jan. 07, 2002
Applicant:
Inventors:
Joseph J. Dlugokecki, Oceanside, CA (US);
Gerardo Bagalawig Nazareno, San Diego, CA (US);
Carmencita I. Robbins, San Diego, CA (US);
Steven David Swendrowski, San Diego, CA (US);
Assignee:
Gel Pak L.L.C., Hayward, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 4/300 ;
U.S. Cl.
CPC ...
H01R 4/300 ;
Abstract
A method is provided for deconstructing an integrated circuit package comprising: taking an integrated circuit package comprising a lead frame having a plurality of wire bond pads for placing a die into electrical contact with the lead frame, and an encapsulant encapsulating the wire bond pads; and removing the encapsulant to expose the wire bond pads; wherein at least a portion of the encapsulant is removed by a lapping process.