This inventor holds 1 USPTO granted patent and 2 published patent applications. Top assignee: E-Systems, Inc.. Active years: 1995.
Company Filing History:
Years Active: 1995
Title: Joseph C. Roesch: Innovator in Thermal Conductivity Solutions
Introduction
Joseph C. Roesch is a notable inventor based in Fairfax Station, VA (US). He has made significant contributions to the field of thermal conductivity through his innovative patent. His work focuses on creating materials that enhance the performance of circuit card assemblies.
Latest Patents
Joseph C. Roesch holds a patent for a high thermal conductivity, matched CTE, low-density mounting plate. This invention involves a circuit card assembly thermal core that utilizes a composite material containing diamond particles and conductive metals such as aluminum, copper, nickel, and beryllium. The diamond particles range from 110 to 160 microns in size and constitute 10 to 80 percent by volume, with a preference for sizes between 140 to 160 microns and a volume of 40 to 60 percent. This composite material is designed to provide both high thermal conductivity and low density, while also matching the coefficient of thermal expansion of other materials used in conjunction.
Career Highlights
Joseph is associated with E-Systems, Inc., where he applies his expertise in thermal materials. His innovative approach has led to advancements in the efficiency and effectiveness of electronic components.
Collaborations
Throughout his career, Joseph has collaborated with notable colleagues, including Mark J. Montesano and John T. Wigand. These partnerships have contributed to the development of cutting-edge technologies in the field.
Conclusion
Joseph C. Roesch's contributions to thermal conductivity solutions exemplify the impact of innovative thinking in engineering. His patent reflects a commitment to enhancing electronic performance through advanced materials.