The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 03, 1995
Filed:
Jul. 28, 1993
Applicant:
Inventors:
Mark J Montesano, Fairfax, VA (US);
John T Wigand, Laurel, MD (US);
Joseph C Roesch, Fairfax, VA (US);
Assignee:
E-Systems, Inc., Dallas, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
361707 ; 75243 ; 75247 ; 75249 ; 428565 ; 428901 ;
Abstract
A circuit card assembly thermal core includes a composite material that includes particles of diamond and a conductive metal such as aluminum, copper, nickel and beryllium and which may be made by pressure infiltration casting. The diamond particles are 110 to 160 microns in size and 10 to 80 percent by volume, and preferably 140 to 160 microns in size and 40 to 60 percent by volume. The composite material has both a high thermal conductivity and low density which may be matched with the coefficient of thermal expansion of other materials with which used.