Anderson, SC, United States of America

Joseph A Aurichio


Average Co-Inventor Count = 1.4

ph-index = 9

Forward Citations = 352(Granted Patents)


Location History:

  • Bronx, NY (US) (1976 - 1978)
  • Anderson, SC (US) (1986 - 1992)

Company Filing History:


Years Active: 1976-1992

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11 patents (USPTO):Explore Patents

Title: The Innovative Mind of Joseph A Aurichio

Introduction:

Joseph A Aurichio, an accomplished inventor based in Anderson, SC, has left a lasting impact in the field of semiconductor technology. With 11 patents to his name, Aurichio's contributions have revolutionized the process of bonding semiconductor chips to substrates.

Latest Patents:

1. Conductive Die Attach Tape: Aurichio's invention of a conductive die attach tape simplifies the mounting of diced semiconductor chips with an adherent conductive adhesive. This advancement streamlines the chip mounting process, making it more efficient and effective.

2. Method of Bonding a Semiconductor Chip to a Substrate: Aurichio's method involves the bonding of tacky, curable chip bonding adhesive to the chip surface before mounting it to a substrate. This innovative approach enhances the bond between the chip and substrate, leading to improved performance and reliability.

Career Highlights:

Aurichio has worked at esteemed companies such as Stauffer Chemical Company and National Starch and Chemical Company. His expertise and dedication to innovation have been instrumental in driving technological advancements in the semiconductor industry.

Collaborations:

Throughout his career, Aurichio has collaborated with talented individuals such as Gregory M Sheyon and Jagadish C Goswami. These partnerships have fostered creativity and innovation, resulting in groundbreaking solutions to complex technological challenges.

Conclusion:

Joseph A Aurichio's inventive spirit and passion for technological advancement have solidified his legacy as a pioneering figure in the semiconductor industry. His patents and collaborations stand as a testament to his innovative prowess and commitment to pushing the boundaries of what is possible in the world of semiconductor technology.

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