The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 18, 1987
Filed:
Jun. 13, 1985
Gregory M Sheyon, Anderson, SC (US);
Joseph A Aurichio, Anderson, SC (US);
Stauffer Chemical Company, Westport, CT (US);
Abstract
The present invention is a die attach film which is adapted for adhesive mounting to a dicing frame. The film contains a support film, a curable die bonding adhesive releasably mounted on the support film which is adapted to receive semiconductor wafer, semiconductor die, and the like, and adhesive means to bond the support film to a dicing frame. In one embodiment the adhesive means comprise pressure sensitive adhesive means on the support film itself adjacent the portions designed to contact the dicing frame. In another embodiment, the adhesive means comprise a larger tacky film bonded to the bottom of the support film for the die attach film.