The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 09, 1990
Filed:
Mar. 06, 1986
Applicant:
Inventor:
Joseph A Aurichio, Anderson, SC (US);
Assignee:
Investment Holding Corporation, Wilmington, DE (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B / ;
U.S. Cl.
CPC ...
156248 ; 156235 ; 156249 ; 156268 ; 156277 ; 156289 ; 156302 ; 156315 ; 156344 ; 252511 ; 252512 ; 4272082 ; 428 40 ; 428202 ; 428206 ; 428352 ;
Abstract
A dicing film to support semiconductor wafers as they are diced into individual chips comprises a support film (e.g., of thermoplastic polymer), a release layer on one side of the film, and a pattern of conductive adhesive attached to the release layer for bonding to the wafer or wafers. The release layer allows for separation of the chip/conductive adhesive combination from the support film. Preferably, the adhesive is covered by a removable release liner prior to mating of the wafer and adhesive.