Viechtach, Germany

Josef Hirtreiter


Average Co-Inventor Count = 2.9

ph-index = 1

Forward Citations = 7(Granted Patents)


Location History:

  • Gerlingen, DE (2003)
  • Viechtach, DE (2001 - 2014)

Company Filing History:


Years Active: 2001-2014

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5 patents (USPTO):

Title: Josef Hirtreiter: Innovator in Chip Packaging Technology

Introduction

Josef Hirtreiter, based in Viechtach, Germany, is a notable inventor known for his significant contributions to the field of chip packaging. With a portfolio consisting of five patents, Hirtreiter's innovations have made a lasting impact in the electronics industry. His exploration of advanced methods in manufacturing has paved the way for more efficient electronic components.

Latest Patents

Among Hirtreiter's latest patents is a "Method of Fabricating a Chip Package." This innovative method details the process of manufacturing a chip package that includes forming an electrically insulating material over a chip side. It involves selectively removing part of the insulating material to create a trench, followed by depositing electrically conductive material which connects to a contact pad on the chip. Furthermore, Hirtreiter has patented a "Method for Producing a Component and Device Comprising a Component," which outlines techniques for applying integrated circuits to a substrate made from paper and encapsulating them effectively.

Career Highlights

Hirtreiter's career includes significant tenures at leading companies such as Infineon Technologies AG and Robert Bosch GmbH. His work at these firms has allowed him to develop and refine his pioneering techniques, contributing to advancements in electronic component production.

Collaborations

Throughout his career, Hirtreiter has collaborated with several prominent professionals in the field. Notable coworkers include Horst Theuss and Albert Auburger, with whom he has worked on various innovative projects, ensuring the sharing of knowledge and expertise within the team.

Conclusion

Josef Hirtreiter stands out as a vital figure in the realm of chip packaging technology. Through his patents and collaborative efforts, he continues to influence the industry, driving innovations that enhance electronic devices' efficiency and reliability. His work exemplifies the kind of impact that skilled inventors can have on technological advancement.

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