The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 28, 2014
Filed:
Jun. 18, 2013
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Horst Theuss, Wenzenbach, DE;
Albert Auburger, Regenstauf, DE;
Jochen Dangelmaier, Beratzhausen, DE;
Josef Hirtreiter, Viechtach, DE;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/84 (2006.01); H01L 23/498 (2006.01); H01L 23/31 (2006.01); H01L 21/683 (2006.01); H01L 21/56 (2006.01); H01L 23/495 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/4985 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/00014 (2013.01); H01L 2224/92247 (2013.01); H01L 2224/16245 (2013.01); H01L 2924/01029 (2013.01); H01L 23/3107 (2013.01); H01L 21/6835 (2013.01); H01L 21/561 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/32245 (2013.01); H01L 24/48 (2013.01); H01L 24/16 (2013.01); H01L 2224/48247 (2013.01); H01L 24/97 (2013.01); H01L 23/49582 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/14 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/01046 (2013.01); H01L 2924/01079 (2013.01); H01L 2224/97 (2013.01); H01L 21/4832 (2013.01);
Abstract
A method for producing a component and device including a component is disclosed. A basic substrate having paper as substrate material is provided, at least one integrated circuit is applied to the basic substrate, the at least one integrated circuit applied on the basic substrate is enveloped with an encapsulant, and at least parts of the basic substrate are removed from the at least one enveloped integrated circuit.