The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 16, 2014
Filed:
Aug. 01, 2012
Josef Hirtreiter, Viechtach, DE;
Walter Hartner, Bad Abbach, DE;
Ulrich Wachter, Regensburg, DE;
Juergen Foerster, Tegernheim, DE;
Josef Hirtreiter, Viechtach, DE;
Walter Hartner, Bad Abbach, DE;
Ulrich Wachter, Regensburg, DE;
Juergen Foerster, Tegernheim, DE;
Infineon Technologies AG, Neubiberg, DE;
Abstract
A method for manufacturing a chip package is provided. The method includes: forming an electrically insulating material over a chip side; selectively removing at least part of the electrically insulating material thereby forming a trench in the electrically insulating material, depositing electrically conductive material in the trench wherein the electrically conductive material is electrically connected to at least one contact pad formed over the chip side; forming an electrically conductive structure over the electrically insulating material, wherein at least part of the electrically conductive structure is in direct physical and electrical connection with the electrically conductive material; and depositing a joining structure over the electrically conductive structure.