This inventor holds 2 USPTO granted patents. Top assignee: Samsung Electro-Mechanics Co., Ltd.. Active years: 2011-2012.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2011-2012
Title: Innovations by JoonSik Shin in Semiconductor Packaging
Introduction
JoonSik Shin is a notable inventor based in Suwon, South Korea. He has made significant contributions to the field of semiconductor packaging, holding 2 patents that focus on innovative manufacturing methods. His work aims to enhance the efficiency and reliability of semiconductor packages.
Latest Patents
One of JoonSik Shin's latest patents is a method of manufacturing a semiconductor package that involves a first board and second boards electrically connected to both sides of the first board. This method includes forming a first board, creating second boards with cavities, and connecting components to the first board using a flip chip method. This innovative approach helps prevent damage to semiconductor chips and reduces manufacturing costs. It also mitigates stresses that can lead to cracking in the boards and semiconductor chips, while avoiding defects such as bending and warpage. Additionally, it eliminates the need for underfill in areas where semiconductor chips connect to the printed circuit board, facilitating easier reworking and lowering costs.
Another patent by JoonSik Shin focuses on a similar method of manufacturing semiconductor packages and semiconductor plastic packages. This method also emphasizes the formation of a first board and second boards, along with the connection of components via a flip chip method. The benefits of this patent mirror those of his previous work, showcasing his commitment to improving semiconductor packaging technology.
Career Highlights
JoonSik Shin is currently employed at Samsung Electro-Mechanics Co., Ltd., where he continues to innovate in the semiconductor field. His expertise and contributions have positioned him as a key player in the development of advanced semiconductor packaging solutions.
Collaborations
JoonSik Shin has collaborated with notable colleagues, including Nobuyuki Ikeguchi and Jung-Hwan Park. Their combined efforts contribute to the advancement of semiconductor technologies and innovations.
Conclusion
JoonSik Shin's work in semiconductor packaging exemplifies the importance of innovation in technology. His patents not only enhance manufacturing processes but also contribute to the overall reliability of semiconductor products. His contributions are vital to the ongoing evolution of the semiconductor industry.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile