Inchun, South Korea

Jong-Yun Lee

This inventor holds 2 USPTO granted patents and 2 published patent applications. Top assignee: Samsung Electro-Mechanics Co., Ltd.. Active years: 2009-2012.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jong-Yun Lee. Retrieved from https://idiyas.com/inventor/jong-yun-lee-d79si75e

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 2 

Average Co-Inventor Count = 6.0

ph-index = 2

Forward Citations = 11(Granted Patents)


Location History:

  • Incheon, KR (2009)
  • Inchun, KR (2012)

Company Filing History:


Years Active: 2009-2012

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2 patents (USPTO):Explore Patents

Title: Innovations of Jong-Yun Lee in Electro-Mechanical Engineering

Introduction

Jong-Yun Lee is a prominent inventor based in Inchun, South Korea. He has made significant contributions to the field of electro-mechanical engineering, particularly in the development of advanced printed circuit boards and manufacturing methods. With a total of 2 patents to his name, Lee's work is recognized for its innovation and practicality.

Latest Patents

One of Jong-Yun Lee's latest patents is for an electro device embedded printed circuit board and its manufacturing method. This invention discloses a printed circuit board that integrates an electro device, featuring a pair of electrodes at either end. The design includes a core substrate with a first cavity, where a first passive device is embedded, being thinner than the core substrate. Additionally, a second passive device is stacked above the first, allowing both devices to cross each other within the cavity.

Another notable patent is a method for manufacturing a wafer level package. This method involves stacking an insulation layer over a wafer substrate, processing a via hole in the insulation layer, and forming a seed layer. The process continues with the formation of a plating resist that corresponds to a redistribution pattern, followed by electroplating to create the redistribution pattern, which includes a terminal for external contact. This innovative approach allows for multiple redistribution layers to be formed using cost-effective PCB processes, enhancing stability and efficiency while reducing manufacturing costs.

Career Highlights

Jong-Yun Lee is currently employed at Samsung Electro-Mechanics Co., Ltd., where he continues to push the boundaries of technology in his field. His work has not only contributed to the company's success but has also advanced the industry as a whole.

Collaborations

Throughout his career, Lee has collaborated with notable colleagues, including Doo-hwan Lee and Sang-Jin Baek. These partnerships have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Jong-Yun Lee's contributions to electro-mechanical engineering through his patents and work at Samsung Electro-Mechanics Co., Ltd. highlight his role as a key innovator in the industry. His inventions are paving the way for future advancements in technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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