This inventor holds 2 USPTO granted patents. Top assignee: Samsung Electro-Mechanics Co., Ltd.. Active years: 2013-2014.
Company Filing History:
Years Active: 2013-2014
Title: Jong Yong Kim: Innovator in Flip Chip Packaging Technology
Introduction
Jong Yong Kim is a prominent inventor based in Daejeon, South Korea. He has made significant contributions to the field of electronic packaging, particularly in the development of flip chip technology. With a total of 2 patents to his name, Kim's work has enhanced the reliability and efficiency of electronic devices.
Latest Patents
Kim's latest patents include a method of manufacturing a flip chip package. This method involves providing a board with a conductive pad and a connection pad, forming a resin layer, and creating a trench to prevent underfill leakage. His second patent describes a flip chip package that includes an electronic device mounted on a board, featuring a resin layer with a trench and a dam member to enhance connection reliability and reduce package defect rates.
Career Highlights
Jong Yong Kim is currently employed at Samsung Electro-Mechanics Co., Ltd., where he continues to innovate in the field of electronic packaging. His work has been instrumental in advancing the technology used in modern electronic devices.
Collaborations
Kim has collaborated with notable coworkers, including Ey Yong Kim and Young Hwan Shin, contributing to various projects that aim to improve electronic packaging solutions.
Conclusion
Jong Yong Kim's contributions to flip chip packaging technology have made a significant impact on the electronics industry. His innovative methods and dedication to improving connection reliability continue to shape the future of electronic device manufacturing.