The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 15, 2013
Filed:
Oct. 27, 2010
Ey Yong Kim, Daejeon, KR;
Young Hwan Shin, Daejeon, KR;
Soon Jin Cho, Chungcheongbuk-do, KR;
Jong Yong Kim, Daejeon, KR;
Jin Seok Lee, Chungcheongbuk-do, KR;
Ey Yong Kim, Daejeon, KR;
Young Hwan Shin, Daejeon, KR;
Soon Jin Cho, Chungcheongbuk-do, KR;
Jong Yong Kim, Daejeon, KR;
Jin Seok Lee, Chungcheongbuk-do, KR;
Samsung Electro-Mechanics Co., Ltd., Suwon, KR;
Abstract
There is provided a flip chip package including an electronic device, a board including a conductive pad disposed inside a mounting region of the board on which the electronic device is mounted, and a connection pad disposed outside the mounting region, a resin layer formed on the board and including a trench formed by removing a part of the resin layer, and a dam member provided on the trench and preventing the leakage of an underfill between the mounting region and the connection pad. Since the dam member, formed on the processed resin layer, can prevent the leakage of the underfill, a package defect rate can be lowered, and connection reliability can be improved.