Chollabuk-do, South Korea

Jong Tae Moon

This inventor holds 1 USPTO granted patent. Top assignee: Hyundai Electronics Industries Co. Ltd.. Active years: 2001.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jong Tae Moon. Retrieved from https://idiyas.com/inventor/jong-tae-moon-yi0z70yk

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 43(Granted Patents)


Company Filing History:


Years Active: 2001

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1 patent (USPTO):Explore Patents

Title: Jong Tae Moon - Innovator in Chip Scale Packaging

Introduction

Jong Tae Moon is a notable inventor based in Chollabuk-do, South Korea. He has made significant contributions to the field of semiconductor technology, particularly in the area of chip scale packaging. His innovative approach has led to the development of a unique patent that enhances the efficiency and reliability of semiconductor devices.

Latest Patents

Jong Tae Moon holds a patent for a chip scale package. This invention discloses a chip scale package that involves bonding a lead frame with an adhesive to the bottom face of a semiconductor chip. An inner lead of the lead frame is connected to a pad of the semiconductor chip with a metal wire, ensuring that the thickness of the inner lead is equal to the original thickness of the lead frame. The outer lead is formed by partially etching the bottom face of the lead frame. The entire assembly is encapsulated with a molding compound, allowing for effective heat dissipation from the semiconductor chip to the lead frame. This design also includes a downward protruding portion at the molding compound, which enhances the bonding height during the wire-bonding process.

Career Highlights

Jong Tae Moon is currently employed at Hyundai Electronics Industries Co. Ltd., where he continues to innovate in the semiconductor field. His work has been instrumental in advancing chip packaging technologies, which are crucial for the performance of modern electronic devices.

Collaborations

Throughout his career, Jong Tae Moon has collaborated with several talented individuals, including Sung H Hong and Chang Jun Park. These collaborations have fostered a creative environment that encourages the development of cutting-edge technologies.

Conclusion

Jong Tae Moon's contributions to chip scale packaging exemplify the importance of innovation in the semiconductor industry. His patent reflects a commitment to enhancing the functionality and reliability of electronic devices. Through his work at Hyundai Electronics Industries Co. Ltd., he continues to push the boundaries of technology, making a lasting impact in his field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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