Jong Hun Cheon

Title: Innovations of Jong Hun Cheon

Introduction

Jong Hun Cheon is a notable inventor based in Gyeongsangbuk-do, South Korea. He has made significant contributions to the field of materials science, particularly in the development of advanced electronic components. With a total of 2 patents to his name, Cheon continues to push the boundaries of innovation in his industry.

Latest Patents

Jong Hun Cheon's latest patents include a copper-clad laminate film and an electronic device that incorporates this innovative material. The first patent discloses a copper-clad laminate film that features a polyimide-based substrate with a fluorine layer on at least one side. This film also includes a tie-layer made from specific metal elements that enhance its performance. The second patent similarly describes a copper-clad laminate film with a fluorine-containing substrate and a tie layer that may consist of a metal or metal alloy. This tie layer is designed to have a thickness ranging from about 10 nm to about 100 nm, ensuring optimal functionality in electronic devices.

Career Highlights

Jong Hun Cheon is currently employed at Toray Advanced Materials Korea Inc., where he applies his expertise in materials science to develop cutting-edge technologies. His work has been instrumental in advancing the capabilities of electronic devices, making them more efficient and reliable.

Collaborations

Throughout his career, Cheon has collaborated with talented individuals such as Ha Soo Lee and Jong Yong Park. These partnerships have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Jong Hun Cheon is a distinguished inventor whose work in copper-clad laminate films has the potential to revolutionize the electronics industry. His contributions, along with his collaborations, highlight the importance of teamwork in driving technological advancements.