The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 03, 2025
Filed:
Dec. 14, 2022
Applicant:
Toray Advanced Materials Korea Inc., Gyeongsangbuk-do, KR;
Inventors:
Jong Hun Cheon, Gyeongsangbuk-do, KR;
Ha Soo Lee, Gyeongsangbuk-do, KR;
Jong Yong Park, Gyeongsangbuk-do, KR;
Assignee:
Toray Advanced Materials Korea Inc., Gyeongsangbuk-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01); B32B 7/12 (2006.01); B32B 15/08 (2006.01); B32B 15/20 (2006.01); C23C 14/20 (2006.01); H05K 1/09 (2006.01); H05K 3/02 (2006.01); H05K 3/38 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0393 (2013.01); H05K 1/09 (2013.01); H05K 3/025 (2013.01); H05K 3/384 (2013.01); B32B 7/12 (2013.01); B32B 15/08 (2013.01); B32B 15/20 (2013.01); C23C 14/20 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/0355 (2013.01);
Abstract
Disclosed are a copper-clad laminate film and an electronic device including the same. The copper-clad laminate film includes a fluorine-containing substrate, a tie layer disposed on the fluorine-containing substrate, and a copper layer disposed on the tie layer, wherein the tie layer may be a metal layer or metal alloy layer including a metal of a metal-oxygen (M-O) bond dissociation energy of 400 kJ/mol or more, and the tie layer may have a thickness of about 10 nm to about 100 nm.