This inventor holds 1 USPTO granted patent. Top assignee: Kec Corporation. Active years: 2015.
Company Filing History:
Years Active: 2015
Title: Innovations of Jong Hong Lee in Semiconductor Technology
Introduction
Jong Hong Lee is a notable inventor based in Seoul, South Korea. He has made significant contributions to the field of semiconductor technology, particularly through his innovative patent.
Latest Patents
Jong Hong Lee holds a patent for a semiconductor device and die bonding structure. This invention addresses the formation of inter-metal compounds with semiconductor dies or lead frames. By doing so, it enhances electrical and mechanical properties, improves wettability, and suppresses the conglomeration of die bonding materials. The semiconductor device includes a semiconductor die, a barrier layer on the die's surface, a first metal layer on the barrier layer, a central metal layer on the first metal layer, and a second metal layer on the central metal layer. The first and second metal layers have a first melting temperature, while the central metal layer has a second melting temperature that is lower than the first.
Career Highlights
Jong Hong Lee is currently associated with Kec Corporation, where he continues to develop innovative solutions in semiconductor technology. His work has been instrumental in advancing the capabilities of semiconductor devices.
Collaborations
He collaborates with talented coworkers, including Sung Jin An and Gab Soo Choi, who contribute to the innovative environment at Kec Corporation.
Conclusion
Jong Hong Lee's contributions to semiconductor technology through his patent demonstrate his commitment to innovation and excellence in the field. His work continues to influence advancements in semiconductor devices.
