Gyenggi-do, South Korea

Jong Ho Shin


Average Co-Inventor Count = 8.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2022-2023

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2 patents (USPTO):Explore Patents

Title: **Innovator Spotlight: Jong Ho Shin**

Introduction

Jong Ho Shin is a notable inventor based in Gyenggi-do, South Korea, recognized for his contributions to semiconductor technology. With a total of two patents to his name, Shin has made significant strides in the field of electronic packaging, particularly in enhancing the reliability and performance of semiconductor devices.

Latest Patents

His latest patents focus on advanced EMI (Electromagnetic Interference) shielding techniques for flip chip packages with exposed die backsides. The patented semiconductor device features a substrate and a semiconductor die mounted over it, with an encapsulant covering part of the die while exposing its surface. A first shielding layer is innovatively designed, consisting of a stainless steel layer in direct contact with the semiconductor die and a copper layer placed above it. This design may also include a protective layer over the copper. Furthermore, one embodiment of the invention involves a heatsink affixed to the semiconductor die via a solder layer, ensuring optimal thermal management. A second shielding layer is utilized on the side surface of the semiconductor die, addressing potential EMI concerns.

Career Highlights

Jong Ho Shin is currently employed at Stats Chippac Pte. Ltd. His work has been instrumental in advancing the company's offerings in the semiconductor packaging industry. His inventive methods contribute to the overall enhancement of product quality and operational safety in electronic devices.

Collaborations

Throughout his career, Shin has collaborated with esteemed colleagues such as Dong Won Son and Byeonghoon Kim. These partnerships have fostered a creative environment that fuels innovation and leads to the development of cutting-edge technologies in the semiconductor sector.

Conclusion

Jong Ho Shin exemplifies the spirit of innovation within the semiconductor industry, contributing his expertise to enhance product designs and functionality. His patented technologies are vital in addressing common challenges in semiconductor packaging, reflecting his important role in shaping the future of electronics.

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