Anyang-si, South Korea

Jong Bo Shim

This inventor holds 4 USPTO granted patents. Top assignee: Samsung Electronics Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jong Bo Shim. Retrieved from https://idiyas.com/inventor/jong-bo-shim-vf78bzpu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 75.0

Average Co-Inventor Count = 3.3

ph-index = 1


Company Filing History:


Years Active: 2026

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4 patents (USPTO):Explore Patents

Title: Jong Bo Shim: Innovator in Semiconductor Packaging

Introduction

Jong Bo Shim is a prominent inventor based in Anyang-si, South Korea. He has made significant contributions to the field of semiconductor technology, particularly in the area of semiconductor packaging. His innovative work has led to the development of a patented technology that enhances the efficiency and reliability of semiconductor devices.

Latest Patents

Jong Bo Shim holds a patent for a semiconductor package and method of fabricating the same. This patent describes a semiconductor package that includes a first wiring structure with a first insulating layer and a first wiring pad. It features a first semiconductor chip positioned on the first wiring structure, a second wiring structure on the first semiconductor chip, and a connecting member linking the two wiring structures. The second wiring structure comprises a second insulating layer and multiple second wiring pads that directly contact one surface of the first semiconductor chip. This innovative design improves the performance and integration of semiconductor devices.

Career Highlights

Jong Bo Shim is currently employed at Samsung Electronics Ltd., a leading global technology company. His role at Samsung has allowed him to work on cutting-edge semiconductor technologies, contributing to the company's reputation for innovation and excellence in the electronics industry. His expertise in semiconductor packaging has positioned him as a key player in the development of advanced electronic components.

Collaborations

Throughout his career, Jong Bo Shim has collaborated with talented colleagues, including Choong Bin Yim and Ji Hwang Kim. These collaborations have fostered a creative environment that encourages the exchange of ideas and the development of innovative solutions in semiconductor technology.

Conclusion

Jong Bo Shim's contributions to semiconductor packaging exemplify the importance of innovation in technology. His patented work not only enhances the functionality of semiconductor devices but also reflects the collaborative spirit of the industry. His ongoing efforts at Samsung Electronics Ltd. continue to shape the future of electronics.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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