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For the Inventor, By the Inventor

Asan, South Korea

Jong Bo Shim

This inventor holds 10 USPTO granted patents and 7 published patent applications. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2005-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jong Bo Shim. Retrieved from https://idiyas.com/inventor/jong-bo-shim-3jxxinb1

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 10 

% Patents Active = 100.0

Average Co-Inventor Count = 2.3

ph-index = 3

Forward Citations = 126(Granted Patents)


Location History:

  • Cheonan, KR (2005 - 2007)
  • Asani-si, KR (2018)
  • Anyang-si, KR (2023)
  • Asan-si, KR (2020 - 2024)

Company Filing History:

goldMedal10 out of 132,108 
 
Samsung Electronics Co., Ltd.
 patents

Years Active: 2005-2025

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10 patents (USPTO):Explore Patents
1. 12283578 - Semiconductor package and method of fabricating same (2025-04-21),
2. 12057366 - Semiconductor devices including a lower semiconductor package, an upper semiconductor package on the lower semiconductor package, and a connection pattern between the lower semiconductor package and the upper semiconductor package (2024-08-06),
3. 11908806 - Semiconductor package and method of fabricating the same (2024-02-20),
4. 11600545 - Semiconductor devices including a lower semiconductor package, an upper semiconductor package on the lower semiconductor package, and a connection pattern between the lower semiconductor package and the upper semiconductor package (2023-03-07),
5. 11069592 - Semiconductor packages including a lower structure, an upper structure on the lower structure, and a connection pattern between the lower structure and the upper structure (2021-07-20),
6. 10680025 - Semiconductor package and image sensor (2020-06-09),
7. 9966364 - Semiconductor package and method for fabricating the same (2018-05-08),
8. 7211889 - Semiconductor package and method for manufacturing the same (2007-05-01),
9. 7161249 - Multi-chip package (MCP) with spacer (2007-01-09),
10. 6847109 - Area array semiconductor package and 3-dimensional stack thereof (2005-01-25),

Title: Innovations of Jong Bo Shim

Introduction

Jong Bo Shim is a prominent inventor based in Asan-si, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 10 patents. His work focuses on enhancing the efficiency and functionality of semiconductor packages.

Latest Patents

One of his latest patents is a semiconductor package and method of fabricating the same. This invention includes a substrate with a first insulating layer and a first conductive pattern, a first semiconductor chip, and an interposer that is spaced apart from the chip. The design also features a connection member and a mold layer that covers the side surfaces of the semiconductor chip and the first element. Another notable patent involves semiconductor devices that consist of a lower semiconductor package and an upper semiconductor package. This invention includes a connection pattern that electrically connects the two structures, enhancing their operational capabilities.

Career Highlights

Jong Bo Shim is currently employed at Samsung Electronics Co., Ltd., where he continues to innovate in semiconductor technology. His work has been instrumental in advancing the capabilities of semiconductor devices, making them more efficient and reliable.

Collaborations

Throughout his career, Jong Bo Shim has collaborated with talented individuals such as Ji Hwang Kim and Jang Woo Lee. These collaborations have contributed to the successful development of various semiconductor technologies.

Conclusion

Jong Bo Shim's contributions to semiconductor technology through his patents and collaborations highlight his role as a leading inventor in the field. His innovative work continues to shape the future of semiconductor devices.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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