Company Filing History:
Years Active: 2018-2019
Title: Innovations by Jonathan G Weis in Chemical Mechanical Polishing
Introduction
Jonathan G Weis is an accomplished inventor based in Bear, Delaware, known for his contributions to the field of chemical mechanical polishing (CMP) technology. With a total of 2 patents, Weis has developed innovative solutions that enhance the efficiency and effectiveness of semiconductor substrate polishing.
Latest Patents
Weis's latest patents include advancements in chemical mechanical polishing pads designed for improved removal rates and planarization. One notable invention provides a CMP polishing pad that features a polyurethane reaction product derived from a thermosetting reaction mixture. This mixture includes a curative of 4,4'-methylenebis(3-chloro-2,6-diethylaniline) and a polyisocyanate prepolymer formed from aromatic diisocyanates. The polishing layer is engineered to achieve specific hardness and modulus properties, ensuring high performance in semiconductor applications. Another patent focuses on high planarization efficiency CMP pads, which utilize a unique polyurethane reaction product that incorporates a hydrophilic portion, enhancing the polishing process.
Career Highlights
Throughout his career, Jonathan G Weis has worked with prominent companies in the semiconductor industry, including Rohm and Haas Electronic Materials CMP Holdings, Inc. and Dow Global Technologies LLC. His experience in these organizations has allowed him to refine his expertise in CMP technology and contribute significantly to the field.
Collaborations
Weis has collaborated with notable colleagues such as Nan-Rong Chiou and George C Jacob, further enriching his work and expanding the impact of his innovations in chemical mechanical polishing.
Conclusion
Jonathan G Weis stands out as a key inventor in the realm of chemical mechanical polishing, with his patents reflecting significant advancements in the technology. His work continues to influence the semiconductor industry, showcasing the importance of innovation in enhancing manufacturing processes.