Johnny M Cook, Jr

Title: Johnny M Cook, Jr: Innovator in Microelectronic Packaging

Introduction

Johnny M Cook, Jr. is a notable inventor based in Glendale, AZ (US). He has made significant contributions to the field of microelectronics, holding a total of 2 patents. His work primarily focuses on innovative packaging solutions for electronic components.

Latest Patents

One of his latest patents is for a microelectronic circuit package. This invention comprises a substrate, an electronic chip mounted on the substrate, a thermal interface material, a spring clip, and a retention frame. The thermal interface material is strategically located between the electronic chip and the slug, allowing for effective thermal coupling without the need for curing. The spring clip plays a crucial role by applying a constant force to the slug, ensuring reliable thermal contact between the electronic chip and the slug.

Another significant patent by Cook is for an integrated circuit cartridge and the method of fabricating it. This cartridge includes a heat pipe that maintains thermal contact with at least one integrated circuit die. A spring clip is utilized to provide a compressive force, ensuring a consistent bond line thickness despite opposing forces such as thermal cycling and vibrations. The cartridge cover not only protects the pins that protrude from the cartridge but also aids in the alignment of the pins with a socket.

Career Highlights

Johnny M Cook, Jr. is currently employed at Intel Corporation, a leading company in the technology sector. His work at Intel has allowed him to push the boundaries of microelectronic packaging, contributing to advancements in the industry.

Collaborations

Throughout his career, Cook has collaborated with talented individuals such as Imran Yusuf and Timothy M Takeuchi. These collaborations have fostered innovation and have been instrumental in the development of his patented technologies.

Conclusion

Johnny M Cook, Jr. is a prominent figure in the field of microelectronics, with a focus on innovative packaging solutions. His contributions through patents and collaborations highlight his commitment to advancing technology in this critical area.