San Jose, CA, United States of America

John Y Xie


Average Co-Inventor Count = 4.4

ph-index = 6

Forward Citations = 450(Granted Patents)


Company Filing History:


Years Active: 1998-2000

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6 patents (USPTO):Explore Patents

Title: Innovator Spotlight: John Y. Xie

Introduction

John Y. Xie, a prominent inventor based in San Jose, California, has contributed significantly to the field of integrated circuit design and packaging. With six patents to his name, he has demonstrated a keen ability to innovate in materials and structural designs that enhance electronic components.

Latest Patents

Among his latest patents, Xie's work includes a groundbreaking design for a ball grid array structure and method for packaging an integrated circuit. This innovative IC package substrate features a dielectric layer with a micro filled via at its center, ensuring efficient electrical coupling between chip bonding pads and ball attach pads. The design utilizes a special micro filled via material that combines binding agents with conductive particles, enhancing the package's electrical conductivity. Additionally, Xie's method for supporting electronic components introduces a revolutionary structure with a conductive support layer and isolated conductive islands, providing robustness and efficiency in component integrations.

Career Highlights

Throughout his career, Xie has made meaningful contributions to Prolinx Labs Corporation, where he applies his expertise in electrical engineering to develop advanced packaging solutions for integrated circuits. His innovative designs have the potential to revolutionize the way electronic components are packaged, leading to greater efficiency and performance in electronic devices.

Collaborations

Working alongside talented colleagues such as Steve S. Chiang and James J. Lan, Xie engages in collaborative endeavors that blend their collective expertise. These partnerships often result in pioneering advancements in the electronics sector, further solidifying their reputation in technology innovation.

Conclusion

John Y. Xie exemplifies the spirit of innovation in the technology sector. With his impressive track record of six patents, he continues to push the boundaries of integrated circuit packaging. His ongoing efforts at Prolinx Labs Corporation and collaboration with esteemed colleagues highlight the importance of teamwork in fostering advancements that shape the future of electronics.

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