Andover, MN, United States of America

John W Janzen

This inventor holds 3 USPTO granted patents. Top assignee: Honeywell International Inc.. Active years: 2005-2011.

IDiyas Innovation Intelligence. (2026). Inventor Profile: John W Janzen. Retrieved from https://idiyas.com/inventor/john-w-janzen

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 1.2

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2005-2011

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3 patents (USPTO):Explore Patents

Title: Innovations by John W. Janzen

Introduction

John W. Janzen is an accomplished inventor based in Andover, MN (US). He has made significant contributions to the field of chemical mechanical polishing (CMP) systems, holding a total of 3 patents. His work focuses on enhancing the efficiency and effectiveness of slurry systems used in various industrial applications.

Latest Patents

Janzen's latest patents include a "System and method for scrubbing CMP slurry systems." This innovative system and apparatus are designed to clean particle deposits from slurry distribution system components by injecting gas bubbles into the slurry solution. The geometry and interval of the bubbles are optimized to achieve maximum cleaning power and rate. This method allows for efficient cleaning of abrasive particle buildup without the need for disassembly or flushing of the slurry distribution system.

Another notable patent is the "Ultrasonic conditioning device cleaner for chemical mechanical polishing systems." This method and system involve a robotic arm that holds and transports the conditioning device between the polish pad area and the cleaning area. The cleaning area features an ultrasonic tank that removes particles, residues, and contaminants from the conditioning device and its mounting hardware. This innovation leads to reduced defect levels in the CMP process.

Career Highlights

John W. Janzen is currently employed at Honeywell International Inc., where he continues to develop and refine technologies that improve industrial processes. His expertise in CMP systems has positioned him as a key player in the field.

Collaborations

Janzen collaborates with various professionals, including his coworker Daniel K. Casey, to drive innovation and enhance the capabilities of CMP systems.

Conclusion

John W. Janzen's contributions to the field of chemical mechanical polishing systems demonstrate his commitment to innovation and efficiency. His patents reflect a deep understanding of the challenges faced in industrial applications, and his work continues to influence the industry positively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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