This inventor holds 1 USPTO granted patent. Top assignee: Motorola Corporation. Active years: 1993.
Company Filing History:
Years Active: 1993
Title: John Summers - Innovator in Microelectronic Vacuum Devices
Introduction
John Summers is a notable inventor based in Apache Junction, AZ (US). He has made significant contributions to the field of microelectronics, particularly with his innovative patent related to high-vacuum substrate enclosures. His work has implications for the efficiency and reliability of microelectronic devices.
Latest Patents
Summers holds a patent for a "High-vacuum substrate enclosure." This invention provides an evacuated region around an array of microelectronic vacuum devices, including a substrate. The design features a first encapsulation member that defines a cavity, a second encapsulation member that mates with the first to create an encapsulated region, and a ledge for supporting the substrate. The sealing agent between the mating surfaces ensures a vacuum seal, allowing for consistent vacuum levels throughout the encapsulated region. This innovation eliminates differential pressure-induced deformation of the substrate and allows for assembly without an evacuated environment.
Career Highlights
John Summers is associated with Motorola Corporation, where he has contributed to various projects in microelectronics. His expertise in vacuum technology has positioned him as a valuable asset in the development of advanced electronic devices.
Collaborations
Throughout his career, Summers has collaborated with notable colleagues, including David A Wiemann and James E Jaskie. These partnerships have fostered innovation and have led to advancements in the field of microelectronics.
Conclusion
John Summers is a distinguished inventor whose work in high-vacuum substrate enclosures has made a significant impact on microelectronic technology. His contributions continue to influence the industry and enhance the performance of electronic devices.