Corvallis, OR, United States of America

John S Evans


Average Co-Inventor Count = 3.0

ph-index = 2

Forward Citations = 61(Granted Patents)


Location History:

  • Corvallis, OR (US) (1996)
  • Oxford, GB (1999)

Company Filing History:


Years Active: 1996-1999

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2 patents (USPTO):Explore Patents

Title: Innovations of John S Evans in Thermal Expansion Materials

Introduction

John S Evans is a notable inventor based in Corvallis, Oregon. He has made significant contributions to the field of materials science, particularly in the development of compounds with low or negative thermal expansion properties. With a total of 2 patents, his work has implications for various applications in engineering and technology.

Latest Patents

One of John S Evans' latest patents focuses on materials with low or negative thermal expansion. The patent describes compounds characterized by a specific formula, A.sub.2-x.sup.3+ A.sub.y.sup.4+ M.sub.z.sup.3+ M.sub.3-y.sup.6+ P.sub.y O.sub.12. These compounds can include various combinations of elements such as aluminum, indium, tungsten, and hafnium. The invention also outlines methods for creating compositions that can effectively decrease the positive thermal expansion of materials, which is crucial for applications requiring dimensional stability under temperature changes.

Career Highlights

Throughout his career, John S Evans has been dedicated to advancing the understanding and application of thermal expansion materials. His innovative approaches have led to the development of novel compounds that can be utilized in various industries, enhancing the performance and reliability of materials used in critical applications.

Collaborations

John has collaborated with esteemed colleagues such as Arthur W Sleight and Mary A Thundathil. These partnerships have fostered a collaborative environment that encourages the exchange of ideas and expertise, further driving innovation in the field.

Conclusion

John S Evans continues to be a significant figure in the realm of materials science, with his inventions paving the way for advancements in thermal expansion technologies. His contributions are vital for the ongoing development of materials that meet the demands of modern engineering challenges.

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