The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 06, 1999
Filed:
Apr. 13, 1998
Abstract
Low or negative thermal expansion compounds are described having a formula of A.sub.2-x.sup.3+ A.sub.y.sup.4+ M.sub.z.sup.3+ M.sub.3-y.sup.6+ P.sub.y O.sub.12. It currently is believed that y can vary from about 0 to about 2, x equals the sum of y and z and varies from about 0.1 to about 1.9. Without limitation, novel compounds satisfying the formula A.sub.2-x.sup.3+ A.sub.y.sup.4+ M.sub.z.sup.3+ M.sub.3-y.sup.6+ P.sub.y O.sub.12 where y=0 may be selected from the group consisting of Al.sub.1.5 In.sub.0.5 W.sub.3 O.sub.12, Al.sub.1.6 In.sub.0.4 W.sub.3 O.sub.12, Al.sub.1.7 In.sub.0.3 W.sub.3 O.sub.12, Al.sub.1.8 In.sub.0.2 W.sub.3 O.sub.12, YAlW.sub.3 O.sub.12, ScAlW.sub.3 O.sub.12, ScGaW.sub.3 O.sub.12, ScInW.sub.3 O.sub.12, ScHoW.sub.3 O.sub.12, ScYbMo.sub.3 O.sub.12 and ErInW.sub.3 O.sub.12. Without limitation, novel compounds satisfying the formula A.sub.2-x.sup.3+ A.sub.y.sup.4+ M.sub.z.sup.3+ M.sub.3-y.sup.6+ P.sub.y O.sub.12 where y=2 may be selected from the group consisting of Hf.sub.2 WP.sub.2 O.sub.12 and Hf.sub.2 MoP.sub.2 O.sub.12. The present invention also provides compositions useful for decreasing the positive thermal expansion of a material or materials included in the compositions. The compositions comprise at least a first material and a second material where the first material has low or negative thermal expansion properties and the second material exhibits positive thermal expansion. Novel compositions and methods for making and using such compositions can be made using a first material selected, without limitation, from the group consisting of Al.sub.2 W.sub.3 O.sub.12, Al.sub.2 Mo.sub.3 O.sub.12, In.sub.2 W.sub.3 O.sub.12, Al.sub.1.5 In.sub.0.5 W.sub.3 O.sub.12, Al.sub.1.6 In.sub.0.4 W.sub.3 O.sub.12, Al.sub.1.7 In.sub.0.3 W.sub.3 O.sub.12, Al.sub.1.8 In.sub.0.2 W.sub.3 O.sub.12, YAlW.sub.3 O.sub.12, ScAlW.sub.3 O.sub.12, ScGaW.sub.3 O.sub.12, ScInW.sub.3 O.sub.12, ScHoW.sub.3 O.sub.12, ScYbMo.sub.3 O.sub.12, ErInW.sub.3 O.sub.12, Al.sub.1.68 Sc.sub.0.02 In.sub.0.3 W.sub.3 O.sub.12, Zr.sub.2 WP.sub.2 O.sub.12, Zr.sub.2 MoP.sub.2 O.sub.12, Hf.sub.2 WP.sub.2 O.sub.12 and Hf.sub.2 MoP.sub.2 O.sub.12. A general method for making compounds having low or negative thermal expansion, and compositions containing such compounds, also is described. The first step of the method comprises purposefully designing compounds to be low or negative thermal expansion compounds according to rules derived empirically. The second step comprises making those compounds designed according to the rules. Examples of negative thermal expansion materials made by such method include NbO.sub.2 F and TaO.sub.2 F.