Company Filing History:
Years Active: 2004-2007
Title: Innovations by John S Cuendet
Introduction
John S Cuendet is a notable inventor based in Mesa, AZ (US), recognized for his contributions to microelectronic packaging technology. He holds two patents that showcase his innovative approach to enhancing the efficiency and cost-effectiveness of microelectronic devices.
Latest Patents
One of his latest patents is for a "Low cost microelectronic circuit package." This invention features a single build-up metallization layer above a microelectronic die, allowing for direct mounting to an external circuit board. The design includes multiple landing pads strategically placed to optimize functionality.
Another significant patent is for a "Dispensing process for fabrication of microelectronic packages." This process involves injecting a liquid encapsulation material into a microelectronic package core, ensuring that the microelectronic die is securely housed. The encapsulation material is cured, and interconnection layers are fabricated to complete the microelectronic package.
Career Highlights
John S Cuendet is currently employed at Intel Corporation, where he continues to innovate in the field of microelectronics. His work has significantly contributed to advancements in packaging technologies, making them more accessible and efficient.
Collaborations
Throughout his career, Cuendet has collaborated with notable colleagues, including Steven N Towle and John Tang. These partnerships have fostered a creative environment that encourages the development of groundbreaking technologies.
Conclusion
John S Cuendet's contributions to microelectronic packaging through his patents reflect his commitment to innovation in the field. His work at Intel Corporation and collaborations with esteemed colleagues further enhance the impact of his inventions.