The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 27, 2007
Filed:
Sep. 05, 2001
Steven Towle, Phoenix, AZ (US);
John Tang, Phoenix, AZ (US);
John S. Cuendet, Mesa, AZ (US);
Henning Braunisch, Chandler, AZ (US);
Thomas S. Dory, Gilbert, AZ (US);
Steven Towle, Phoenix, AZ (US);
John Tang, Phoenix, AZ (US);
John S. Cuendet, Mesa, AZ (US);
Henning Braunisch, Chandler, AZ (US);
Thomas S. Dory, Gilbert, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
A low cost microelectronic circuit package includes a single build up metallization layer above a microelectronic die. At least one die is fixed within a package core using, for example, an encapsulation material. A single metallization layer is then built up over the die/core assembly. The metallization layer includes a number of landing pads having a pitch that allows the microelectronic device to be directly mounted to an external circuit board. In one embodiment, the metallization layer includes a number of signal landing pads within a peripheral region of the layer and at least one power landing pad and one ground landing pad toward a central region of the layer.