Company Filing History:
Years Active: 2010-2012
Title: John Robert Diroll: Innovator in Semiconductor Technology
Introduction
John Robert Diroll is a notable inventor based in Sandy, UT (US), recognized for his contributions to semiconductor technology. With a total of 2 patents, Diroll has made significant advancements in the field, particularly in the design and functionality of semiconductor die packages.
Latest Patents
Diroll's latest patents focus on semiconductor die packages utilizing thin dies and metal substrates. These innovative packages comprise a metal substrate and a semiconductor die that features a first surface with a first electrical terminal and a second surface with a second electrical terminal, along with at least one aperture. The metal substrate is securely attached to the second surface, enhancing the overall performance and reliability of the semiconductor package. A plurality of conductive structures is integrated into the semiconductor die, including at least one conductive structure positioned within the aperture. Additional conductive structures may also be placed on the first surface of the semiconductor die, further optimizing its functionality.
Career Highlights
John Robert Diroll is currently employed at Fairchild Semiconductor Corporation, where he continues to develop cutting-edge technologies in the semiconductor industry. His work has contributed to the advancement of efficient and reliable semiconductor solutions, which are crucial for various electronic applications.
Collaborations
Throughout his career, Diroll has collaborated with talented professionals, including Hamza Yilmaz and Steven Paul Sapp. These collaborations have fostered a creative environment that encourages innovation and the sharing of ideas.
Conclusion
John Robert Diroll's contributions to semiconductor technology through his patents and work at Fairchild Semiconductor Corporation highlight his role as a key innovator in the field. His advancements in semiconductor die packages demonstrate the importance of innovation in enhancing electronic performance and reliability.