The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 11, 2012
Filed:
Jun. 25, 2010
Hamza Yilmaz, Saratoga, CA (US);
Steven Sapp, Felton, CA (US);
Qi Wang, Sandy, UT (US);
Minhua LI, Sandy, UT (US);
James J. Murphy, South Jordan, UT (US);
John Robert Diroll, Sandy, UT (US);
Hamza Yilmaz, Saratoga, CA (US);
Steven Sapp, Felton, CA (US);
Qi Wang, Sandy, UT (US);
Minhua Li, Sandy, UT (US);
James J. Murphy, South Jordan, UT (US);
John Robert Diroll, Sandy, UT (US);
Fairchild Semiconductor Corporation, San Jose, CA (US);
Abstract
A semiconductor die package is disclosed. The semiconductor die package comprises a metal substrate, and a semiconductor die comprising a first surface comprising a first electrical terminal, a second surface including a second electrical terminal, and at least one aperture. The metal substrate is attached to the second surface. A plurality of conductive structures is on the semiconductor die, and includes at least one conductive structure disposed in the at least one aperture. Other conductive structures may be disposed on the first surface of the semiconductor die.