Rehoboth, MA, United States of America

John Pereira

This inventor holds 20 USPTO granted patents and 2 published patent applications and 4 EPO patents, primarily in Lead-Free Solder Technology. Top assignee: Antaya Technologies Corporation. Active years: 2000-2018.

IDiyas Innovation Intelligence. (2026). Inventor Profile: John Pereira. Retrieved from https://idiyas.com/inventor/john-pereira

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 20 

% Patents Active = 85.0

 

Average Co-Inventor Count = 2.3

ph-index = 7

Forward Citations = 133(Granted Patents)


Location History:

  • Rehoboth, MA (US) (2000 - 2018)
  • Cranston, RI (US) (2018)

Company Filing History:


Years Active: 2000-2018

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Areas of Expertise:
Lead-Free Solder
Solder Composition
Electrical Connector
Flux Reservoirs
Indium-Tin-Silver
Low Temperature Solder
Solder Apparatus
Clad Aluminum Connector
Casting Solder
Presoldered Surface
Circular Connector
20 patents (USPTO):Explore Patents

Title: Innovations by John Pereira: Advancements in Lead-Free Solder Technology

Introduction

John Pereira, an influential inventor based in Rehoboth, MA, has made significant contributions to the field of solder technology with a remarkable portfolio of 20 patents. His innovative work primarily focuses on lead-free solder compositions, which have critical applications in electronics, particularly for glass components.

Latest Patents

Among his latest patents, the "Method of forming a lead-free solder composition" details a process where various elements such as indium, nickel, copper, silver, antimony, zinc, and tin are mixed to create a robust alloy. This patented method results in a solder composition suitable for bonding electrical connectors to contact surfaces on glass components, with specific weight percentages for each ingredient ensuring optimal performance.

Another notable patent is for "Indium-tin-silver based lead free solder," which encompasses alloys that primarily consist of indium or tin. This innovation not only improves soldering methods but also enhances the reliability of electrical connections. Detailed methods for producing these alloys are also included, showcasing Pereira's comprehensive approach to innovation in the field.

Career Highlights

John Pereira's journey has been marked by his association with Antaya Technologies Corporation, where he continues to lead advancements in solder technology. His work is recognized for addressing environmental concerns associated with traditional lead-based solders. Pereira’s inventions contribute significantly to safe and effective electronic applications, solidifying his position as a leading inventor in his industry.

Collaborations

At Antaya Technologies Corporation, John collaborates with esteemed colleagues Stephen C. Antaya and Manuel H. Machado. Their teamwork fosters a rich environment for innovation, amplifying their collective impact on the field of electronics and solder technology.

Conclusion

John Pereira’s innovative spirit and dedication to developing lead-free solder solutions have positioned him as a pivotal figure in the electronics industry. With a strong foundation of patents, his contributions not only address environmental challenges but also pave the way for future advancements in solder technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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