The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 22, 2018

Filed:

May. 28, 2014
Applicant:

Antaya Technologies Corp., Cranston, RI (US);

Inventors:

Jennie S. Hwang, Moreland Hills, OH (US);

John Pereira, Cranston, RI (US);

Alexandra Mary Mackin, West Warwick, RI (US);

Joseph C. Gonsalves, North Attleboro, MA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 35/00 (2006.01); B23K 1/00 (2006.01); B23K 35/26 (2006.01); B23K 35/24 (2006.01); C03C 27/04 (2006.01); C22C 28/00 (2006.01); C22C 1/02 (2006.01); B60R 16/02 (2006.01); H05K 1/03 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
B23K 35/26 (2013.01); B23K 35/24 (2013.01); B60R 16/02 (2013.01); C03C 27/046 (2013.01); C22C 1/02 (2013.01); C22C 28/00 (2013.01); H05K 1/0306 (2013.01); H05K 3/3457 (2013.01); B60Y 2410/115 (2013.01);
Abstract

A solder composition includes about 4% to about 25% by weight tin, about 0.1% to about 8% by weight antimony, about 0.03% to about 4% by weight copper, about 0.03% to about 4% by weight nickel, about 66% to about 90% by weight indium, and about 0.5% to about 9% by weight silver. The composition can further include about 0.2% to about 6% by weight zinc, and, independently, about 0.01% to about 0.3% by weight germanium. The composition can be used to solder an electrical connector to an electrical contact surface on a glass component.


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